Titanium Sputtering Targets

Product Introduction

A sputtering target deposits the film that the customer sells, so target purity and grain uniformity translate directly into coating performance. This page covers titanium targets produced by high-purity melting and multi-directional forging for PVD and magnetron sputtering lines.

Specification Table

Applications and Titanium Advantages

The targets are used in physical vapour deposition and magnetron sputtering for glass, semiconductor and optoelectronic coating processes. Impurities change the electrical and optical behaviour of the deposited layer, and an uneven grain structure produces an uneven sputter and a shorter target life, so purity, grain size and dimensions all have to be specified.

• High-purity melting and multi-directional forging produce fine, uniform grains for even sputtering.
• Target purity is controlled because trace impurities directly alter the properties of the deposited film.
• Target dimensions, thickness and bonding can be produced to the sputtering equipment being used.

Quality and Purchasing Information

Confirm the required purity, target dimensions and thickness, grain-size requirement, bonding or backing plate, quantity and the equipment the target will run in. Tibars reviews the specification against the targets offered and confirms the purity and grain structure in writing before the order is placed.

• Clarify the grade, size, tolerance, quantity and delivery schedule required for these titanium sputtering targets so the quotation reflects the actual scope.
• Confirm which certificates, test reports and inspection documents are needed for these titanium sputtering targets and they will be matched to the order specification.
• Custom dimensions, finishes or assemblies for these titanium sputtering targets are quoted after the drawing and operating conditions have been reviewed.

Request a Quotation

Send the purity, dimensions, thickness, bonding requirement and quantity, and Tibars will quote these titanium sputtering targets with the applicable analysis documents.