High Purity Titanium Sputtering Targets

High Purity Titanium Sputtering Targets

1. Core Innovation: Redefining Purity & Performance​

• Product Name: Ultra-High-Purity Titanium Sputtering Targets (Gr1-Gr12 Grades)
• Purity Benchmark:
• Titanium Content: ≥99.95% (ASTM B348)
• Impurity Control: <0.02% (O, N, C ≤0.005%; Fe ≤0.01%)
• Density: 4.51 g/cm³ (±0.02)
• Why This Matters:
• Film Integrity: Sub-ppm impurity levels eliminate voids and inclusions, ensuring uniform film thickness (±2%) and adhesion strength (peel test >50 MPa).
• Grain Structure: 50–100 μm equiaxed grains (SEM-verified) reduce arcing and improve sputtering rate stability by 30% .
• Technical Edge:
• Vacuum Induction Melting: 99.999% purity feedstock melted under 10⁻³ Pa vacuum.
• Hot Isostatic Pressing (HIP): 1,200°C/200 MPa treatment to close pores <5 μm.
• CNC Precision Machining: Tolerances ±0.05 mm for critical dimensions (e.g., target thickness).

2. Application-Specific Solutions​

2.1 Semiconductor Manufacturing​

Wafer Coating: Gr1 (99.5% Ti) targets for gate dielectric layers (oxide/nitride interfaces).

Case Study: Reduced particulate contamination by 80% in 300mm wafer sputtering.

2.2 Optical Coatings​

Anti-Reflective Films: Gr5 (Ti-6Al-4V) targets for UV/IR optics (refractive index control: n=2.2–2.6).

UV-C Lenses: Achieves 99.8% transmission in 200–400 nm range.

2.3 Energy Storage​

Solid-State Batteries: Gr7 (Ti-0.2Pd) targets for solid-electrolyte interfaces (ionic conductivity: 10⁻³ S/cm).

2.4 Advanced Electronics​

Flexible Circuits: Gr12 (Ti-0.3Mo-0.8Ni) targets for stretchable conductor lines (strain tolerance: 300%).

3. Quality Assurance & Compliance​

Certifications:

• ISO 9001: Full traceability from raw material to finished product.
• ASTM B381: Hydrogen embrittlement resistance <200 kPa.
• RoHS/REACH: <100 ppm restricted substances.

Testing Protocols:

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